Specifications
| Thermal Solution | Passive cooling |
| Form Factor | 2U Server and up |
| CPU Socket | Socket FCLGA 4677 |
| CPU Support | Intel Sapphire Rapids Processor |
| Maximum TDP Support | 490 W |
| Heatsink Material | Copper Vapor Chamber and heat pipe, Aluminum Fin Stack |
| Dimensions | 118 x 78 x 64 mm |
| Weight | 526.6 g |
| Thermal Compound | Pre-Printed with SHIN-ETSU 7762 |
| Mounting System | Intel Standard Anti-Tilt Heatsink Captive Mounting Sets |
| Package Carrier Included | E1A and E1B |